Metal encapsulated ceramic tile thermal insulation, and associated systems and methods

ABSTRACT

A metal encapsulated ceramic tile thermal insulation system for rockets and associated methods is disclosed. A representative system includes a launch vehicle having a first end and a second end generally opposite the first end and includes a heat shield positioned at the second end. The heat shield includes a plurality of thermal protection apparatuses, where individual of the thermal protection apparatuses include ceramic tiles encapsulated by inner and outer metal layers, which are positioned on opposing top and bottom surfaces of the ceramic tiles. The plurality of thermal protection apparatuses includes a plurality of pins positioned within corresponding holes drilled through the ceramic tiles and are secured to the metal layers. The outer metal layer can protect the ceramic tile from tool strikes and debris and can also prevent water from reaching and being absorbed by the ceramic tile.

CROSS-REFERENCE TO RELATED APPLICATION

This non-provisional patent application claims the benefit of andpriority to U.S. Provisional Patent Application No. 62/684,145, titled“METAL ENCAPSULATED CERAMIC TILE THERMAL INSULATION, AND ASSOCIATEDSYSTEMS AND METHODS”, filed Jun. 12, 2018, which is incorporated hereinin its entirety by reference.

TECHNICAL FIELD

The present technology relates to metal encapsulated ceramic tilethermal insulation, and associated systems and methods, for example,thermal protection systems and heat shields for rockets.

BACKGROUND

Rocket manufacturers continually strive to reduce the costs of launchinga payload into space. One approach for reducing such costs is toretrieve one or more booster stages used to propel the space launchvehicle. In a particular approach, the booster is launched and landedvertically and refurbished for another launch. One drawback to thisapproach is that the exterior surfaces of the booster, including theengine nozzles, are subjected to high temperatures, which can result indamage to these surfaces during ascent and/or descent. To overcome thisdrawback, launch and reentry vehicle manufacturers utilize insulationand cooling systems designed to reduce the amount of heat the enginenozzles and/or other surfaces are exposed to during flight. Conventionaltypes of insulation include ceramic tiles that form a heat shield on thebottom surface of the booster. However, these ceramic tiles are brittleand not very robust, often requiring refurbishment between launches.Further, the ceramic tiles are typically very porous and must bewaterproofed before every launch to prevent the tiles from soaking upwater, which undesirably increases the weight of the booster.Accordingly, there is a need for improved insulation systems, e.g., forreusable launch vehicles.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partially schematic, side elevation view of a representativelaunch vehicle system having insulation systems configured in accordancewith embodiments of the present technology.

FIG. 2 is an enlarged, partially schematic, elevation view of one end ofthe launch vehicle of FIG. 1 having a heat shield formed from thermalprotection apparatuses, configured in accordance with embodiments of thepresent technology.

FIG. 3 is a perspective view of one of the thermal protectionapparatuses shown in FIG. 2 .

FIG. 4 is a cut-away isometric view of a representative thermalprotection apparatus, configured in accordance with embodiments of thepresent technology.

FIGS. 5 and 6 show schematic, cross-sectional views of representativethermal protection apparatuses, configured in accordance withembodiments of the present technology.

FIGS. 7 and 8 show schematic, cross-sectional views of sealingmechanisms between two adjacent thermal protection apparatuses,configured in accordance with embodiments of the present technology.

DETAILED DESCRIPTION

Several embodiments of the present technology are directed to systemsand apparatuses for insulating structures, e.g., rocket structures andcomponents, to reduce the effects of heat. For example, the presenttechnology can include a thermal protection apparatus having a rigidinsulation layer positioned between and attached to two metal layersusing pins. The thermal protection apparatus can be attached to therocket components with an adhesive or with fasteners that couple to thepins. This approach can combine the insulating properties of the rigidinsulation layer with the strength and durability of the metal toinsulate the rocket when the rocket reenters the atmosphere and lands.For example, the rigid insulation can inhibit or prevent heat frompenetrating through the thermal protection apparatus to the body of therocket during reentry, while the metal layers can reduce damage to therigid insulation from foreign object damage and can help to preventwater from reaching and being absorbed by the insulation. Further, thepins can be placed in holes formed through both the insulation and themetal layers and can be attached to the metal layers in order to securethe metal layers to the insulation. As a result, the thermal protectionapparatus can insulate the rocket structures and components using theinsulation while the metal layers can protect the insulation fromdamage.

Specific details of several embodiments of the disclosed technology aredescribed below with reference to particular, representativeconfigurations. The disclosed technology can be practiced in accordancewith rockets, heat shields, and/or insulation having other suitableconfigurations. Specific details describing structures or processes thatare well-known and often associated with rockets and insulation, butthat can unnecessarily obscure some significant aspects of the presentlydisclosed technology, are not set forth in the following description forpurposes of clarity. Moreover, although the following disclosure setsforth some embodiments of different aspects of the disclosed technology,some embodiments of the technology can have configurations and/orcomponents different than those described in this section. Further,unless otherwise specifically noted, elements depicted in the drawingsare not necessarily drawn to scale. As such, the present technology caninclude some embodiments with additional elements and/or without severalof the elements described below with reference to FIGS. 1-8 .

FIG. 1 is a partially schematic elevation view of a system 100 thatincludes a launch vehicle 110 having opposing first and second ends 111and 112 and that is capable of ascending and descending in oppositedirections but with generally the same orientation (e.g., a tail-downorientation). Accordingly, the launch vehicle 110 can ascend in a firstdirection 101 and descend in a second direction 102. The launch vehicle110 includes a first stage 113 (e.g., a booster) having a body 115, anda second stage 114 that can carry a payload 116 (e.g., one or morehumans, supplies, experiments, etc.). In other embodiments, the launchvehicle 110 can include other numbers of stages (e.g., a single stage ormore than two stages). The launch vehicle 110 is elongated along avehicle axis V and the payload 116 can be positioned at the first end111. The launch vehicle 110 can include a pre-determined separationlocation 117 at which the first stage 113 separates from the secondstage 114, typically during ascent. The launch vehicle 110 can alsoinclude landing gear that support the launch vehicle 110 when it is notairborne or space-borne, and one or more elements (e.g., fins) thatprovide stability and control for the launch vehicle 110.

The first stage 113 includes a propulsion system 118 positioned at thesecond end 112 and coupled to the body 115. The propulsion system 118includes nozzles 119 oriented to direct exhaust products in a generallydownward direction (i.e. in the second direction 102). The propulsionsystem 118 also includes a plurality of combustion chambers locatedwithin the body 115 of the launch vehicle 110, with each of the nozzles119 coupled to a given one of the combustion chambers. Each of thecombustion chambers receives fuel from a fuel pump coupled to a fueltank within the body 115. An igniter ignites the fuel within thecombustion chambers, creating high energy exhaust products that aredirected through the associated nozzles 119. Each of the nozzles 119 ispositioned to direct the exhaust products away from the second end 112of the launch vehicle 110 (e.g., in the second direction 102), therebygenerating thrust that propels the launch vehicle in the first direction101.

Once the launch vehicle 110 reaches a specific and pre-determined pointin the launch process (e.g., a specific altitude or speed, a specificamount of fuel consumed, etc.), the first and second stages 113 and 114separate from each other at the separation location 117. In someembodiments, the second stage 114 includes a secondary propulsion systemused to propel the second stage 114 towards its final destination afterthe first and second stages 113 and 114 separate, while the first stage113 returns back to earth. In other embodiments, the second stage 114does not include a secondary propulsion system and both the first andsecond stages 113 and 114 return to earth after separation. The firststage 113 can also include lateral thrusters to stabilize and controlthe first stage 113 as it returns to earth. Further details of thelateral thrusters are included in pending U.S. Published PatentApplication No. US 2017/0349301, incorporated herein by reference.

As the first stage 113 descends, the propulsion system 118 and thelateral thrusters work together to control the orientation and speed ofthe first stage 113 as it returns to earth. In a representativeembodiment, the propulsion system 118 and the lateral thrusters controlthe first stage 113 as it descends such that first stage 113 moves inthe second direction 102 and the vehicle axis V is generally parallel tothe second direction 102. As it approaches the landing site, the firststage 113 has a generally vertical orientation such that the seconddirection 102 and the vehicle axis V are both oriented perpendicular tothe ground and the one or more nozzles 119 direct the exhaust productsdownward, causing the first stage 113 to decelerate. Landing gear, whichcan be stowed during ascent and descent, extend from the body of thefirst stage 113 and support the weight of the first stage 113 as itlands. Once the first stage 113 lands, the propulsion system 118 shutsdown and the first stage 113 is secured to the landing site. In thisway, the first stage 113 may be used for subsequent launches and onlyminor refurbishments and part replacements may be required betweensubsequent launches of the first stage 113.

Throughout the launching and landing processes, the launch vehicle 110is subjected to extreme conditions. For example, the second end 112 ofthe first stage 113 is subjected to high air pressures and temperaturescaused by friction between the air and the second end 112. To reduce theeffects of the high temperatures, the launch vehicle 110 includes athermal protection system 120 positioned at or at least toward thesecond end 112, and that includes shielding, insulation, and/or othercooling systems. For example, to protect the second end 112 of the body115 from these high temperatures, the thermal protection system 120 alsoincludes a heat shield 121 coupled to the body 115 at the second end112. The heat shield 121 is positioned against the body 115 andinsulates the body 115 from the high temperatures.

FIG. 2 shows an enlarged view of the second end 112 of the first stage113 of the launch vehicle 110. The heat shield 121 is coupled to thebody 115 of the first stage 113 adjacent to the nozzles 119 and is usedto insulate the body 115 from high temperatures as the first stage 113descends in the second direction 102. The heat shield 121 can be formedfrom a plurality of thermal protection apparatuses 130 securely coupledto the body 115. The thermal protection apparatuses 130 can be modular,and can be arranged in an array over the second end 112 of the body 115to fully cover the second end 112. In some embodiments, each of thethermal protection apparatuses 130 can be generally rectangular andplanar. In other embodiments, some of the thermal protection apparatuses130 can be generally rectangular and planar while others can be curvedand/or rounded to conform to the shape of the second end 112.

FIG. 3 shows a perspective view of a representative rectangular thermalprotection apparatuses 130 having a length L and width W. In someembodiments, the thermal protection apparatus 130 can be sized andshaped such that the length L is approximately 18 inches and the width Wis approximately 12 inches. In other embodiments, the length L and widthW can have other suitable values. The thermal protection apparatus 130can include a ceramic tile 134 positioned between an outer metal portion(e.g., a layer) 133 and an inner metal portion (e.g., a layer) 135. Withthis arrangement, the outer metal layer 133 defines an outer surface 131of the thermal protection apparatus 130 while the inner metal layer 135defines an inner surface 132. When the thermal protection apparatus 130is coupled to the launch vehicle, the thermal protection apparatus 130is positioned such that the inner surface 132 faces towards the body ofthe launch vehicle while the outer surface 131 faces away. The thermalprotection apparatus 130 can also include one or more holes 144 thatextend through the outer metal layer 133, the ceramic tile 134, and theinner metal layer 135. In representative embodiments, the metal layers133 and 135 and the ceramic tile 134 are coupled together with one ormore corresponding pins 136 positioned within the holes 144 and coupledto the metal layers 133 and 135. The pins 136 can be arranged in rowsand columns within the thermal protection apparatus 130 and each of thepins can be configured to extend from the outer surface 131 to the innersurface 132 by passing through the outer metal layer 133, the ceramictile 134, and the inner metal layer 135. The pins 136 are each securelycoupled to the outer metal layer 133 to hold the outer metal layer 133against the ceramic tile 134 and to prevent the outer metal layer 133from detaching. The thermal protection apparatus 130 can also includeedging 137 positioned around the perimeter of the ceramic tile 134.

FIG. 4 shows an isometric cut-away view of a representative thermalprotection apparatus 130. The ceramic tile 134 includes opposing top andbottom surfaces 140 and 141. The outer and inner metal portions (e.g.,layers) 133 and 135 can each include a thin layer of metal and can bepositioned directly against the ceramic tile 134 such that the outermetal layer 133 is positioned against the top surface 140 and the innermetal layer 135 is positioned against the opposing bottom surface 141.The ceramic tile 134 is generally rectangular and can include a notch138 formed in the top surface 140 and extending around the perimeter ofthe ceramic tile 134. The edging 137 can be formed from a thin sheet ofcorrugated metal (e.g., Inconel® 660 available from Special MetalsCorporation at www.specialmetals.com/) positioned directly against edgeportions 142 of the ceramic tile 134 and coupled to the outer and innermetal layers 133 and 135. As will be discussed in greater detail below,the outer metal layer 133 can laterally expand when the thermalprotection apparatus 130 is heated, while the ceramic tile 134 and theinner metal layer 135 may not expand (or may not expand significantly).The corrugated structure of the edging 137 can increase the flexibilityof the edging 137 to allow the edging 137 to remain coupled to both theouter metal layer 133 and the inner metal layer 135 as the outer metallayer 133 expands.

The edging 137 can include top and bottom bent portions 143 a and 143 b,which are bent over the edge portions 142 of the ceramic tile 134. Morespecifically, the top bent portion 143 a is positioned between the outermetal layer 133 and the ceramic tile 134 in the notch 138 while thebottom bent portion 143 b is positioned against the inner surface 132such that the inner metal layer 135 is positioned between the bottombent portion 143 b and the ceramic tile 140. Further, the top bentportion 143 a is positioned within the notch portion 138 such that topbent portion 143 a is coplanar with the top surface 140. As a result,the edging 137 does not extend above the top surface 140, therebyallowing the outer surface 131 to remain generally flat. To couple theedging 137 to the outer and inner metal layers 133 and 135, the outermetal layer 133 can be welded (e.g., tack welded) to the top bentportion 143 a and the inner metal layer 135 can be welded to the bottombent portion 143 b. In some embodiments, the ceramic tile 134 can alsoinclude a second notch portion formed in the bottom surface 141 thatextends around the perimeter of the ceramic tile 134 and the bottom bentportion 143 b can be positioned within the second notch portion. Inthese embodiments, the bottom bent portion 143 b can be positionedbetween the inner metal layer 135 and the ceramic tile 134 such that theedging 137 does not extend below the inner surface 132. As will bediscussed in further detail below, the outer metal layer 133 can includea lip portion 139 that extends past the edge portions 142 and the edging137 and that can be used to form a seal between adjacent thermalprotection apparatuses 130.

In representative embodiments, the outer metal layer 133 is formed fromsheet metal that is less than or equal to 0.25 inches thick and that iscut into a desired size and shape. The outer metal layer can be formedfrom a metal having high strength and oxidation resistance at hightemperatures. During reentry, the temperature that the outer metal layer133 is heated to generally depends on the speed of the first stage as itdescends, where the speed is generally dependent on the altitude atwhich the first and second stages separated. As such, the outer metallayer 133 can be formed from a metal that retains its strength andoxidation resistance throughout the descent. For example, in embodimentsfor which the expected temperature does not exceed 1400° F., the outermetal layer 133 can be formed from a metal such as titanium (or alloysthat include titanium), which retains its strength and oxidationresistance up to approximately 1400° F. However, in embodiments forwhich the expected temperature reaches temperatures greater than 1400°F., the outer metal layer 133 can be formed from nickel-based alloys(e.g., Haynes 230® alloys available from Haynes International atwww.haynesintl.com/, Inconel® 625 alloys available from Special MetalsCorporation at www.specialmetals.com/, HASTELLOY C-22® alloys availablefrom Haynes International at www.haynesintl.com/, etc.), which canretain their strength and oxidation resistance at temperatures up toapproximately 2000° F., or refractory alloys (e.g., TZM alloys availablefrom Ed Fagan Inc. at www.edfagan.com/, C-103 alloys available from ATIat www.atimetals.com/), which can retain their strength at temperaturesgreater than 3000° F.

The outer metal layer 133 typically does not reflect and/or reject heatincident on the outer surface 131. Accordingly, when the outer metallayer 133 is heated, the heat passes through the outer metal layer 133to the ceramic tile 134. The ceramic tile 134 can be formed from a rigidand porous ceramic material having a low thermal conductivity, a hightemperature resistance, and a low coefficient of thermal expansion, andthat can include silica and/or alumina fibers bonded together (e.g.,CT300 Tooling Board available from COMPOTOOL at www.compotool.com/). Assuch, when the ceramic material is exposed to heat and hightemperatures, the ceramic tile 134 generally retains its size and shapewhile efficiently rejecting heat transfer. With this arrangement, pointswithin the ceramic tile 134 near the top surface 140 can be hotter thanpoints within the ceramic tile 134 further from the top surface 140. Asa result, a temperature gradient can be established through the ceramictile 134. Accordingly, the ceramic tile 134 can prevent heat frompenetrating completely through the ceramic tile 134 so that temperaturesat the bottom surface 141 are maintained at lower levels. Further, theceramic material can have a low density and can be easily manufacturedto have a suitable shape and a selected thickness T. The total amount ofheat that the ceramic tile 134 rejects is at least partially dependenton the thickness T of the ceramic tile 134 and the thickness T cantherefore be selected based on the amount of heat that the thermalprotection apparatus 130 is expected to be exposed to during descent. Insome embodiments, the thickness T can be approximately 1 inch, between0.25 and 1 inch, or can be between 1 and 3 inches.

In some embodiments, the porous ceramic material can be capable ofreadily absorbing water (e.g., water from the atmosphere such as rain,snow, humidity, etc. or water used in cooling or noise suppressionsystems). However, water is dense and saturating the ceramic tile 134with water can increase the weight of the thermal protection apparatus130. To restrict or prevent water ingress, the outer metal layer 133 canact as a hermetic waterproof barrier and can prevent most of the waterincident on the outer surface 131 from reaching and being absorbed bythe ceramic tiles 134. To further reduce the amount of water capable ofbeing absorbed by the ceramic material, the thermal protection apparatus130 can include waterproofing applied to the ceramic tile 134. In someembodiments, the waterproofing can be applied to the ceramic tile 134 bysubmerging the ceramic tile 134 in the waterproofing material for asuitable amount of time.

In some embodiments, the waterproofing can be applied to the bottomsurface 141 and the edge portions 142 of the ceramic tile 134. In otherembodiments, the waterproofing can be applied through the entirethickness T. However, the high temperatures at points within the ceramictile 134 near the top surface 140 can cause the waterproofing near thetop surface 140 to burn off while the waterproofing near the bottomsurface 141 can remain intact throughout the launch and landing. Becausesome of the waterproofing remains within the ceramic tile 134 andbecause the outer metal layer 133 can prevent most of the water fromreaching the ceramic tile 134, the amount of water that can be absorbedby the ceramic tile 134 can be reduced and the thermal protectionapparatus 130 can be used for multiple launches and landings withouthaving to apply waterproofing between launches.

In addition to or in lieu of increasing the waterproofing abilities ofthe thermal protection apparatus 130, the outer metal layer 133 canincrease the durability and toughness of the thermal protectionapparatus 130. For example, the ceramic material can be brittle and cancrack and break if struck by a tool or by foreign object debris (FOD)during flight. Accordingly, the outer metal layer 133 can provideprotection to the ceramic tile 134 from tool strikes and FOD, therebyincreasing the impact resistance of the thermal protection apparatus130. In this way, the ceramic tile 134 can be formed from a wider arrayof materials. For example, the ceramic tile 134 can be formed fromceramic materials having a high temperature resistance but that are verybrittle and tend to fracture easily, as the outer metal layer 133 canprevent the ceramic tile 134 from being struck by tool strikes and FOD.Furthermore, the outer metal layer 133 can be electrically conductiveand can be capable of discharging electricity and/or avoiding chargebuild-up due to lightning, static charges, and/or other sources.

Because the ceramic material can prevent or at least restrict heat fromreaching the inner metal layer 135, the inner metal layer 135 can beformed from different metals than the outer metal layer 133. Forexample, in representative embodiments, the inner metal layer 135 isformed from aluminum or another suitable lightweight metal. The innermetal layer 135 can have a thickness of less than or equal to 0.25inches and can be used as a back plate to help the pins 136 secure theouter metal layer 133 to the ceramic tile 134. In other embodiments,however, the thermal protection apparatus 130 can be formed without theinner metal layer 135 and instead can include a layer of anothersuitable type of lightweight material, such as a composite, positionedagainst the bottom surface 141. In still other embodiments, the thermalprotection apparatus 130 can be formed without the inner metal layer 135or any other layer such that the bottom surface 141 is exposed and theceramic tile 134 is positioned directly against the body of the firststage. In these embodiments, the weight of the thermal protectionapparatus 130 can be reduced compared to existing thermal protectionsystems, thereby reducing the cost of launching the launch vehicle.

When heated, metal typically expands and can even deform. As such, whenthe thermal protection apparatus 130 is exposed to high temperatures,the outer metal layer 133 heats up and tends to expand laterally.However, the ceramic material that forms the ceramic tile 134 has a lowcoefficient of thermal expansion and the inner metal layer 135 isshielded from the high temperatures. Accordingly, neither the ceramictile 134 nor the inner metal layer 135 expand significantly when thethermal protection apparatus 130 heats up, resulting in the outer metallayer 133 moving laterally relative to the ceramic tile 134 and/or theinner metal layer 135. This thermal expansion mismatch can createstresses on the pins 136, which extend through the entire thickness ofthe thermal protection apparatus 130. To prevent the pins 136 fromdetaching from the outer metal layer 133 when the outer metal layerexpands and moves, the pins 136 can be formed from a generally flexiblematerial capable of bending and elastically deforming. For example, insome embodiments, the pins 136 can be formed from metals such asmolybdenum or niobium. In other embodiments, the pins 136 can be formedfrom the same metal that the outer metal layer 133 is formed from. Inthis way, the pins 136 can remain securely attached to the outer metallayer 133 as the outer metal layer 136 expands and contracts.

FIG. 5 shows a cross-sectional view of one of the pins 136 positionedwithin a hole 144. To allow the pins 136 sufficient room to bend andflex, each of the holes 144 can be larger than the pins 136. Forexample, in some embodiments, the pins 136 and the holes 144 can begenerally cylindrical and the holes 144 can have a diameter larger thanthat of the pins 136. In these embodiments, the pins 136 can bend andflex in any direction within the hole. In other embodiments, the pins136 can be cylindrical while the holes 144 are slot-shaped such that thepins 136 are able to bend and flex along a predetermined direction. Ingeneral, the holes 144 can have any suitable size and shape that enablesthe pins 136 to bend and/or flex sufficiently during operation of thethermal protection apparatus 130.

Each of the holes 144 is formed through the outer metal layer 133, theceramic plate 134, and the inner metal layer 135, thereby extending fromthe outer surface 131 to the inner surface 132. When forming the thermalprotection apparatus 130, the sheets of metal that form the outer andinner metal layers 133 and 135 can be positioned against the respectivetop and bottom surfaces 140 and 141 of the ceramic tile 134 before theholes 144 are formed. Once the metals layers 133 and 135 are properlypositioned, a drill can be used to form the holes 144 through the outermetal layer 133, the ceramic tile 134, and the inner metal layer 135 andone of the pins 136 can be positioned within each of the holes 144. Thepins 136 can be longer than the thickness of the thermal protectionapparatus 130 such that the opposing ends of the pins extend beyond theouter and inner surfaces 131 and 132. Once the pins 136 are positionedwithin their respective holes 144, the pins 136 can be coupled to theouter and inner metal layers 133 and 135. For example, the pins 136 canbe securely held in place with threaded nuts, clips, fasteners,brackets, welds, and/or any combination thereof. In the illustratedembodiment, the pin 136 is spot-welded to the outer and inner metallayers 133 and 135 such that the pin 136 is attached to the outer metallayer 133 with weld 145 a and to the inner metal layer 135 with weld 145b.

After attaching the pins 136 to the inner and outer metal layers 133 and135, the thermal protection apparatus 130 can be attached to the body115 of the first stage of the launch vehicle. In the illustratedembodiment, an adhesive 146 is applied to the inner surface 132 toattach the thermal protection apparatus 130 to the body 115. Theadhesive 146 can be a room temperature vulcanizing (RTV) siliconeadhesive that can operate at temperatures up to 500° F. (e.g., RTV560available from Momentive Performance Materials at www.momentive.com) orcan include another suitable type of adhesive.

In other embodiments, however, the thermal protection apparatus 130 canbe attached to the body 115 without using an adhesive. For example, FIG.6 shows a cross-sectional view of an embodiment of the thermalprotection apparatus 130 that utilizes a fastener 147 coupled to the pin136 to attach the thermal protection apparatus 130 to the body 115. Inthe illustrated embodiment, the hole 144 extends through a portion(e.g., a layer) of the body 115. The pin 136 is welded to the outermetal layer 133 with the weld 145 a and extends through the outer metallayer 133, the ceramic tile 134, the inner metal layer 135, and aportion of the body 115. The pin 136 extends completely through theportion of the body 115 and the fastener 147 attaches to the end of thepin 136 within the body 115. In this way, the fastener 147 and the body115 act as a bracket that uses the pin 136 and the weld 145 a to pullthe outer metal layer 133 into the ceramic tile 134. In otherembodiments, the pin 136 can be attached to the body 115 using adifferent attachment mechanism, such as a nut. In still otherembodiments, the pin 136 can be welded to the body 115. In any of theseembodiments, the portion of the body 115 to which the pin 136 isattached can be a shell that is accessible from inside for attachment.In other embodiments, the pin 136 can be attached using blind fasteningtechniques. In the illustrated embodiment, the inner metal layer 135 ispositioned directly against the body 115 of the launch vehicle. In otherembodiments, an adhesive (e.g., adhesive 146) can be used such thatthermal protection apparatus 130 is coupled to the body 115 with boththe fastener 147 and the adhesive.

When arranging the thermal protection apparatuses 130 on the launchvehicle, gaps between adjacent thermal protection apparatuses 130 mayinitially be present. For example, in some embodiments, adjacent thermalprotection apparatuses 130 can be separated from each other by a gap ofapproximately 0.19 inches. To prevent water and heat from passingthrough these gaps, the gaps can be sealed. FIG. 7 shows across-sectional view of two thermal protection apparatuses 130 separatedfrom each other by a gap 148. In the illustrated embodiment, the uppermetal layer 133 on the right thermal protection apparatuses 130 includesa lip portion 139. The lip portion 139 extends over the gap 148 and ispositioned over the outer surface 131 of the left thermal protectionapparatus 130. The lip portion 139 can be slightly bent so that it ispositioned directly against the outer surface 131 and can be welded tothe outer metal layer 133 of the left thermal protection apparatus 130to couple the two thermal protection apparatuses 130 to each other. Agasket 149 can be positioned within the gap 148 between the two edgings137, and a ceramic rope seal 150 can be positioned between the gasket149 and the body 115 of the launch vehicle.

When the thermal protection apparatus 130 heats up, both the outer metallayer 133 and the edging 137 can expand due to thermal expansion.Accordingly, both of the outer metal layers 133 and both of the edgings137 can expand into the gap 148. As they expand, the width of the gap148 decreases and the gasket 149, which can be formed from a ceramichaving a low thermal expansion coefficient, can be pushed by one of theedgings 137 until it contacts the other edging 137. The gasket 149 canbe sandwiched between the two edgings 137, forming a seal that prevents,or at least inhibits, heat from passing through the gap 148. The ceramicrope seal 150 can be used to prevent, or at least inhibit, heat thatpasses by the gasket 149 from reaching the body 115. Further, thetemperature gradient established by the ceramic tile 134 when thethermal protection apparatus 130 is heated results in the top portionsof the edgings 137 (i.e., the portions of the edgings 137 near the outermetal layer 133) expanding and deforming significantly more than thebottom portions of the edgings 137 (i.e., the portions of the edgings137 near the inner metal layer 135), which may not substantially deformor expand due to heat.

Each of the thermal protection apparatuses 130 can include the lipportion 139. For example, in some embodiments, each of the generallyrectangular thermal protection apparatuses 130 can have two adjacentsides that each includes the lip portion 139 while the other two sidesdo not. In these embodiments, the thermal protection apparatuses 130 arearranged such that the edges having the lip portion 139 are positioneddirectly adjacent to the edges of an adjacent thermal protectionapparatus 130 that do not have the lip portion 139. In this way, thethermal protection apparatuses 130 can be arranged such that each gap148 is covered by a single lip portion 139. In other embodiments, thethermal protection apparatuses 130 can include lip portions 139 on twoopposing edges and not the other two edges. In still other embodiments,some of the thermal protection apparatuses 130 that form the heat shieldcan include lip portions 139 on all four edges while other thermalprotection apparatuses 130 do not include lip portions 139 along any ofthe edges.

In some embodiments, none of the thermal protection apparatuses 130include lip portions 139. In these embodiments, the gaps 148 can besealed using other sealing mechanisms. FIG. 8 shows a cross-sectionalview of a representative sealing mechanism. In this embodiment, neitherof the outer metal layers 133 of adjacent thermal protection apparatuseshave lip portions that extend over the gap 148. Instead, a T-seal 151 ispositioned within the gap 148. The T-seal 151 can be a generallyT-shaped structure having a first portion 152 coupled to a secondportion 153 that is generally perpendicular to the first portion 152.The first portion 152 can be positioned on the outer surface 131 and canextend across the gap 148 while the second portion 153 can be positionedwithin the gap 148 and can extend from the first portion 152 to the body115 of the launch vehicle. The T-seal 151 can be formed from metal andcan be welded to the thermal protection apparatuses 130 and/or the body115 to seal the gap 148. For example, the first portion 152 can bewelded (e.g., tack welded) to the outer metal layers 133 of the twoadjacent thermal protection apparatuses 130 and the second portion 153can be welded to the body 115 within the gap 148. In this way, theT-seal 151 can help to prevent or inhibit heat and water from enteringthe gap 148. In some embodiments, ceramic gaskets can be positionedwithin the gap 148 between the second portion 153 and the edgings 137 inorder to provide additional thermal protection to the body 115.

In the illustrated embodiments, the outer metal layer 133 is formed fromsheet metal cut to a suitable size and shape and positioned on theceramic tile 134. In other embodiments, the outer metal layer 133 can beformed using other techniques. For example, in some embodiments, theouter metal layer 133 can be formed using a thermal spray technique. Inthese embodiments, holes can be drilled into the ceramic tile 134 andthe pins can be inserted into the holes before the outer metal layer 133is formed. After depositing the pins within the holes, metal feedstockcan be melted (e.g., via electricity, plasma, or a flame) and the moltenmetal can be sprayed or otherwise disposed over the top surface of theceramic tile 134. The molten metal can weakly bond (or not bond at all)with the ceramic tile 134 but can strongly bond with the metal pins.

From the foregoing, it will be appreciated that several embodiments ofthe disclosed technology have been described herein for purposes ofillustration, but that various modifications can be made withoutdeviating from the technology. For example, in some applications, thethermal protection apparatus can be filled with a material other than aceramic, and/or can be or can include a soft and flexible material. Thethermal protection apparatus can be coupled to any portion of a launchvehicle, and/or vehicles that do not ascend into space, such asairplanes and/or helicopters. The thermal protection apparatus can beapplied to stationary structures such as furnaces and power plants. Moregenerally, in some embodiments, the thermal protection apparatus can becoupled to any suitable structure to provide insulation to thatstructure. In some embodiments, a single thermal protection apparatusincludes multiple pins to secure the outer and inner metal portions tothe tile, and in some embodiments, a single pin performs this function.

Certain aspects of the technology described in the context of particularembodiments can be combined or eliminated in other embodiments. Forexample, the edging can be positioned around the top half of the ceramictile but not the bottom half or can be eliminated entirely. Further,while advantages associated with some embodiments of the disclosedtechnology have been described herein, configurations with differentcharacteristics can also exhibit such advantages, and not allconfigurations need necessarily exhibit such advantages to fall withinthe scope of the technology. Accordingly, the disclosure and associatedterminology can encompass other arrangements not expressly shown ordescribed herein.

To the extent any materials incorporated herein by reference conflictwith the present disclosure, the present disclosure controls. As usedherein, the phrase “and/or” as in “A and/or B” refers to A alone, Balone and both A and B.

1-20. (canceled)
 21. A thermal protection apparatus, comprising: a rigidceramic tile having a top surface, a bottom surface, and a plurality ofholes that extend between the top surface and the bottom surface; anouter metal portion positioned adjacent to and fully covering the topsurface, wherein the outer metal portion defines an exterior surface ofthe thermal protection apparatus; an edging positioned around aperimeter of the ceramic tile, wherein the edging has a top bent portioncoupling the edging to the outer metal portion; and a plurality ofelongate elements positioned within corresponding ones of the holes,wherein individual ones of the elongate elements are coupled to theouter metal portion.
 22. The thermal protection apparatus of claim 21,further comprising an inner metal portion positioned adjacent to andfully covering the bottom surface.
 23. The thermal protection apparatusof claim 22 wherein individual ones of the elongate elements are coupledto the inner metal portion.
 24. The thermal protection apparatus ofclaim 22 wherein the edging is further coupled to the inner metalportion, and wherein the edging is configured to remain coupled to theouter metal portion and the inner metal portion as the outer metalportion expands.
 25. The thermal protection apparatus of claim 24wherein the edging is formed of a corrugated metal.
 26. The thermalprotection apparatus of claim 21 wherein the edging extends between thetop surface and the bottom surface.
 27. The thermal protection apparatusof claim 21 wherein— the ceramic tile includes a notch formed in the topsurface that extends around the perimeter of the ceramic tile, and thetop bent portion is positioned in the notch such that the top bentportion is coplanar with the top surface and is positioned between theceramic tile and the outer metal portion.
 28. The thermal protectionapparatus of claim 21 wherein the outer metal portion includes a lipportion that projects laterally past the edging.
 29. The thermalprotection apparatus of claim 21 wherein the top bent portion iscoplanar with the top surface and positioned between the ceramic tileand the outer metal portion.
 30. The thermal protection apparatus ofclaim 21, further comprising an inner metal portion positioned adjacentto and fully covering the bottom surface, and wherein the edgingincludes a bottom bent portion coupling the edging to the inner metalportion.
 31. The thermal protection apparatus of claim 30 wherein theceramic tile includes a notch formed in the bottom surface and thatextends around the perimeter of the ceramic tile, and wherein the bottombent portion is positioned within the notch such that the bottom bentportion is coplanar with the bottom surface.
 32. The thermal protectionapparatus of claim 21 wherein the holes are larger than thecorresponding ones of the elongate elements such that the elongateelements can bend and flex within the corresponding ones of the holes.33. The thermal protection apparatus of claim 21 wherein the edging isformed of a corrugated metal.
 34. A thermal protection apparatus,comprising: a tile having a first surface, a second surface, and aplurality of holes that extend between the first surface and the secondsurface, wherein the tile is formed of a rigid material configured toinhibit heat transfer therethrough and to retain a shape and a sizethereof when the tile is exposed to high temperature; a metal layerpositioned adjacent to and fully covering the first surface, wherein thefirst metal layer defines an exterior surface of the thermal protectionapparatus; an edging positioned around a perimeter of the tile, whereinthe edging has a top bent portion coupling the edging to the outer metallayer; and a plurality of elongate elements positioned withincorresponding ones of the holes, wherein individual ones of the elongateelements are coupled to the outer metal layer.
 35. The thermalprotection apparatus of claim 34 wherein the edging extends between thefirst surface and the second surface, and wherein the edging is formedof a corrugated metal.
 36. The thermal protection apparatus of claim 34wherein— the tile includes a notch formed in the first surface thatextends around the perimeter of the tile, the top bent portion ispositioned in the notch such that the top bent portion is coplanar withthe first surface and is positioned between the tile and the metallayer, and the metal layer includes a lip portion that projectslaterally past the edging.
 37. The thermal protection apparatus of claim34 wherein the metal layer is a first metal layer, and furthercomprising a second metal layer positioned adjacent to and fullycovering the second surface.
 38. A thermal protection apparatus,comprising: a rigid ceramic tile having a top surface and a bottomsurface; an outer metal layer positioned adjacent to and fully coveringthe top surface, wherein the outer metal layer defines an exteriorsurface of the thermal protection apparatus; and an edging positionedaround a perimeter of the ceramic tile, wherein the edging has a topbent portion coupling the edging to the outer metal layer.
 39. Thethermal protection apparatus of claim 38 wherein the edging extendsbetween the top surface and the bottom surface, and wherein the edgingis formed of a corrugated metal.
 40. The thermal protection apparatus ofclaim 38, further comprising at least one pin extending through theceramic tile and coupled to the outer metal layer.